Paper-like displays will combine many of the best features of electronic displays and conventional printing. They will improve the sustainability of content distribution and display manufacturing They will be lightweight, mechanically robust, low power, viewable in a variety of lighting conditions, and most importantly low cost.
Hewlett-Packard Laboratories and PowerFilm Solar are building active matrix displays on polymer substrates using roll-to-roll (R2R) processes exclusively. The approach combines plasma deposition, wet and dry etching and self-aligned imprint lithography (SAIL).
SAIL solves the challenge of patterning and aligning submicron features on meter-scale substrates by encoding the geometry for all of the patterning steps into discrete heights of a 3-dimensional masking structure. The 3-dimensional mask is imprinted on the film stack in advance of patterning and maintains alignment regardless of process induced substrate distortion.
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About the speaker:
Director Advanced Display Research,Hewlett-Packard Company
Carl is the leader of a research team at HP Labs that is developing next generation display technologies. The common thread in HP’s display research is a belief that in the future displays will be manufactured on plastic substrates using roll-to-roll manufacturing. HP is investigating color reflective and emissive frontplane technologies as well as semiconductor and circuit technologies for active matrix backplanes and driver circuits. HP has demonstrated the world’s first fully roll-to-roll manufactured active matrix eInk displays on our 1/3 meter wide pilot manufacturing line.
Over his 20 years at HP, Carl has worked mostly on storage technologies including hard disc, helical scan tape, probe storage, and optical disc. Carl led the HP team that developed the technology which enables ROM compatible rewritable DVDs. This technology is the basis for the DVD+RW format.
Carl received a B.S. degree from Stanford University and a Masters and Ph.D. from the Massachusetts Institute of Technology all in mechanical engineering.
HP Labs MS 1198
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