Principal Investigator(s): Shan X. Wang

Sponsor(s): Texas Instruments

The trend of chip scaling (Moore’s Law) has driven research focusing on integration of magnetic inductors onto silicon die or package.  Using standard silicon processing as well as specialized processes, we are fabricating broad bandwidth inductors on die or package with soft magnetic cores for power delivery and conversion applications. Accurate analytical models, Kerr-effect domain imaging, and high frequency permeameters are deployed to understand the design tradeoff and pitfalls of magnetic inductors. Significant gains over air core inductors in the frequency range of 1-100 MHz are anticipated for magnetic integrated inductors.

Magnetic inductor for power conversion