Transfer printing methods for flexible electronics

Constructing electronics on non-conventional substrates, such as paper, clothes, and plastics, can benefit a range of technologies, including flexible displays, paper electronics, bio-integrated sensors, etc. Unfortunately, the non-conventional substrates are limited by processing temperature, incompatibility with chemicals, and handling difficulties, and thus they are not allowed for conventional fabrication process. To overcome this limitations, our group develops diverse “transfer printing methods” that enables integration of electronics into flexible, transparent, and/or attachable substrates which were not accessible before.

Water-assisted Transfer printing for nanowire electronics. Fully fabricated nanowire electronics can be simply lifted from their mother substrate (e.g., silicon wafer) inside water bath at room temperature and transferred onto diverse non-conventional substrates without defects.

Crack-assisted Transfer printing for vertical nanowire array electronics. High density, vertical silicon nanowire arrays can be controllable separated and transferred to arbitrary substrates through the formation of a horizontal crack allowing for the fabrications of flexible vertical nanowire array electronics.

Selected Publications

  1. "Fabrication of Nanowire Electronics on Nonconventional Substrates by Water-Assisted Transfer Printing Method", C. H. Lee, D. R. Kim, and X. L. Zheng, Nano Lett., 11, 3435-3439 (2011).
  2. "Fabrication of Flexible and Vertical Silicon Nanowire Electronics", J. M. Weisse, C. H. Lee, D. R. Kim, and X. L. Zheng, Nano Lett., 12, 3339-3343 (2012)
  3. "Fabricating nanowire devices on diverse substrates by simple transfer-printing methods", C. H. Lee, D. R. Kim, and X. L. Zheng, Proc. Natl. Acad. Sci. U.S.A., 107, 9950-9955 (2010).