Yasser Khan is a postdoctoral scholar at Stanford University, advised by Professor Zhenan Bao in Chemical Engineering and Professor Boris Murmann in Electrical Engineering. Yasser completed his Ph.D. in Electrical Engineering and Computer Sciences from the University of California, Berkeley, in Professor Ana Claudia Arias’ Group. He received his B.S. and M.S. in Electrical Engineering from the University of Texas at Dallas and King Abdullah University of Science and Technology, respectively. Yasser’s research focuses on wearable medical devices, with an emphasis on skin-like soft sensor systems. His research experience includes internships at Oxford University, Stanford University, and Zyvex Labs in Texas.
Yasser received the EECS departmental fellowship at UC Berkeley, discovery scholarship and graduate fellowship at KAUST, and academic excellence scholarship at UT Dallas. He also received numerous awards at MRS meetings. Yasser published over 40 research publications and presentations in the most reputed platforms in the field, which were highlighted by BBC News, Wall Street Journal, NSF News, MSN News, Yahoo News, and many more.
I am grateful for funding from all the funding agencies and instituitions that supported my research.
|Jul 24, 2020||Paper on potentiometric mechanotransduction in Science Advances|
|May 27, 2020||I am giving a talk on non-invasive ventilators at Stanford's Wearable Electronics seminar series|
|May 27, 2020||Preprint on non-invasive ventilator in arXiv|
|Mar 6, 2020||Paper on ambient light oximeter in Advanced Materials Technologies|
|Jan 15, 2020||Paper on scalable fabrication of high-performance pressure sensors in Advanced Electronic Materials|
|Nov 19, 2019||Review paper on flexible hybrid electronics in Advanced Materials|
|Sep 6, 2019||Paper on reflectance PPG sensor design and redundancy in IEEE Access|
|Jun 25, 2019||Invited talk at Stanford's Wearable Electronics seminar series|
|May 31, 2019||Paper on reliability challenges in flexible hybrid electronics in IEEE Transactions on Components, Packaging and Manufacturing Technology|
|Dec 12, 2018||Invited talk at Kateeva|