IWSHM 2013 Organizing Committee

Academia

D. Adams, Purdue University, USA, deadams [AT] purdue.edu
G. Akhras, Royal Military College of Canada, Canada, akhras [AT] rmc.ca
A. Emin Aktan, Drexel University, USA, aaktan [AT] drexel.edu
A. Braga, Rio Pontificia Unversidade Catolica do Rio de Janiero, abraga [AT] mec.puc-rio.br
F. Casciati, University of Pavia, Italy, Fabio [AT] dipmec.univpv.it
F.K. Chang (Chairman), Stanford University, USA, fkchang [AT] stanford.edu
W. K. Chiu, Monash University, Australia, wing.kong.chiu [AT] monash.edu.au
C. Fritzen, University of Siegen, Germany, fritzen [AT] imr.mb.uni-siegen.de
B. Glisic, Princeton University, bglisic [AT] princeton.edu
A. Guemes (Co-Chairman), Universidad Politecnica De Madrid, Spain, aguemes [AT] aero.upm.es
P. Hagedorn, TU Darmstadt, Germany, peter.hagedorn [AT] dyn.tu-darmstadt.de
D. Inman, Virginia Tech, USA, dinman [AT] vt.edu
S. Kapuria, India Institute of Technology, New Delhi, kapuria [AT] am.iitd.ac.in
A. Kiremidjian, Stanford University, USA, ask [AT] stanford.edu
T. Kundu, U. of Arizona, USA, tkundu [AT] email.arizona.edu
J. Lynch, U. of Michigan, USA, jerlynch [AT] umich.edu
A. Mita, Keio University, Japan, mita [AT] sd.keio.ac.jp
Y.Q. Ni, Hong Kong Polytechnic University, Hong Kong, ceyqni [AT] polyu.edu.hk
W. Ostachowicz, Polish Academy of Sciences, Poland, wieslaw [AT] imppan.imp.gda.pl
U. Peil, Technical University of Braunschweig, Germany, u.peil [AT] t-online.de
W. Staszewski, Sheffield University, UK, w.j.staszewski [AT] sheffield.ac.uk
F. Lanza Scalea, UC San Diego, USA, flanza [AT] ucsd.edu
H. Sohn, KAIST, Korea, hoonsohn [AT] kaist.ac.kr
N. Takeda, University of Tokyo, Japan, takeda [AT] compmat.rcast.u-tokyo.ac.jp
M. Wang, Northeast University, USA, mi.wang [AT] neu.edu
Z. (Sam) Wu, Dalian Institute of Technology, China, wuzhanjun [AT] gmail.com
Z. Wu, Ibaraki University, Japan, zswu [AT] mx.ibaraki.ac.jp

Industry

S. Arms, Microstrain, USA, swarms [AT] microstrain.com
S. Beard, Acellent Technologies, USA, sjb [AT] acellent.com
M. Buderath, EADS, Germany, Matthias.buderath [AT] eads.com
P. Foote, BAE, UK, peter.foote [AT] baesystems.com
B. Glass, Lockheed-Martin, USA, betty.c.glass [AT] lmco.com
G. Gordon, Honeywell, USA, grant.gordon [AT] honeywell.com
M. Hansen, Goodrich, USA, matt.hansen [AT] goodrich.com
E. Haugse, Boeing Company, USA, eric.d.haugse [AT] boeing.com
H. Speckmann, Airbus, Germany, holger.speckmann [AT] airbus.com
P. Anchieta da Silva, Embraer, Brazil, anchieta [AT] embraer.com.br
H. Wenzel, VCE Holding GmbH, Austria, wenzel [AT] vce.at

Government

C. Boller, IZFP, Germany, christian.boller [AT] izfp.fraunhofer.de
M. Derriso, Wright-Patterson Air Force Laboratories, USA, mark.derriso [AT] wpafb.af.mil
C. Farrar, Los Alamos National Laboratory, USA, farrar [AT] lanl.gov
S. Galea, DSTO Australia, Australia, steve.galea [AT] dsto.defence.gov.au
B. Lamattina, Army Research Office, USA, bruce.lamattina [AT] us.army.mil
D. Le, US Army Research Laboratory, USA, dy.le [AT] us.army.mil
B.L. Lee, Air Force Office of Scientific Research, USA, byunglip.lee [AT] afosr.af.mil
S. Liu, National Science Foundation, USA, sliu [AT] nsf.gov
S. Mahmood, Naval Surface Warfare Center, USA, shah.mahmood [AT] navy.mil
W. Prosser, NASA-Langley, USA, w.h.prosser [AT] larc.nasa.gov
O. Venta, VTT, Finland, olli.venta [AT] vtt.fi
L. Salvino, liming.salvino [AT] navy.mil
A. Srivastava, NASA-Ames, USA, ashok.n.srivastava [AT] nasa.gov
D. Stargle, david.stargle [AT] afosr.af.mil
F. Wu, NIST, USA, felix.wu [AT] nist.gov
N. Li, China Communications Construction, China, ln_prc [AT] yahoo.com.cn