Prof. Fu-Kuo Chang , Dept. of Aero/Astro, Stanford University, USA, fkchang@stanford.edu
Prof. Anne Kiremidjian, Dept. of CEE, Stanford University, USA, ask@stanford.edu
Prof. Kinchao Law, Dept. of CEE, Stanford University, law@stanford.edu
Prof. Kenneth Loh, Dept. of CEE, UC-Davis, USA, kjloh@ucdavis.edu
Mr. Samuel Huang, US Army, NASA Ames, USA, Samuel.s.huwang.civ@mail.mil
Prof. Debbie Senesky, Dept. of Aero/Astro, Stanford University, dsenesky@stanford.edu

Academia

D. Adams, Vanderbilt University, USA, douglas.adams@vanderbilt.edu
G. Akhras, Royal Military College of Canada, Canada, akhras@rmc.ca
O. Buyukozturk, Massachusetts Institute of Technology, USA, obuyuk@mit.edu
F. Casciati, University of Pavia, Italy, Fabio@dipmec.univpv.it
F.K. Chang (Chairman), Stanford University, USA, fkchang@stanford.edu
L. Cheng, Hong Kong Polytechnic University, Hong Kong, mmlcheng@inet.polyu.edu.hk
W. K. Chiu, Monash University, Australia, wing.kong.chiu@monash.edu.au
P. Foote, Cranfield University, UK, p.d.foote@cranfield.ac.uk
C. Fritzen, University of Siegen, Germany, fritzen@imr.mb.uni-siegen.de
B. Glisic, Princeton University, USA, bglisic@princeton.edu
A. Guemes (Co-Chairman), Universidad Politecnica De Madrid, Spain, aguemes@dmpa.upm.es
D. Inman, University of Michigan, Ann Arbor, USA, daninman@umich.edu
S. Kapuria, India Institute of Technology, New Delhi, kapuria@am.iitd.ac.in
T. Kundu, U. of Arizona, USA, tkundu@email.arizona.edu
V. L. Cam, Laboratoire Central des Point et Chausses, France, Vincent.le-cam@icpc.fr
H. Li, Harbin Institute of Technology, China, lihui@hit.edu.cn
C. Lopes, UNESP, Brazil, Vicente@dem.feis.unesp.br
J. Lynch, U. of Michigan, USA, jerlynch@umich.edu
Y.Q. Ni, Hong Kong Polytechnic University, Hong Kong, ceyqni@polyu.edu.hk
W. Ostachowicz, Polish Academy of Sciences, Poland, wieslaw@imppan.imp.gda.pl
W. Staszewski, AHG University of Science and Technology, Poland, w.j.staszewski@sheffield.ac.uk
F. Lanza Scalea, UC San Diego, USA, flanza@ucsd.edu
H. Sohn, KAIST, Korea, hoonsohn@kaist.ac.kr
N. Takeda, University of Tokyo, Japan, takeda@compmat.rcast.u-tokyo.ac.jp
M. Wang, Northeast University, USA, mi.wang@neu.edu
K. Worden, University of Sheffield, UK, k.worden@sheffield.ac.uk

Industry

M. Buderath, Airbus Defense, Germany, Matthias.buderath@eads.com
C. Bockenhiemer, Airbus, Germany, Clemens.Bockenheimer@airbus.com
C. Carella, UTC Aerospace Systems, USA, christopher.carella@utas.utc.com
M. Davis, Sikorsky, USA, madavis@sikorsky.com
E. Haugse & C. Davis, Boeing Company, USA, eric.d.haugse@boeing.com (Christopher.i.davis @boeing)
A. Kumar, Acellent Technologies, USA, akumar@acellent.com
J. Pinsonnault, Bombardier, Canada, Jerome.pinsonnault@aero.bombardier.com
F. Rodriguez-Lence, Airbus, Spain, Fernando.rodriguez@military.airbus.com
X. Qing, COMAC, China, qingxinlin@comac.cc
H. Speckmann, Testier, Germany, holger.speckmann@airbus.com
P. Anchieta da Silva, Embraer, Brazil, anchieta@embraer.com.br
A. N. Srivastava, Verizon, USA, ashok.srivastava@verizon.com
H. Voges, Honeywell, USA, hal.voges@honeywell.com
H. Wenzel, VCE Holding GmbH, Austria, wenzel@vce.at

Government

C. Boller, IZFP, Germany, christian.boller@izfp.fraunhofer.de
K. Ding, China Special Equipment Inspection and Research Institute, China, ding_keqin@csei.org.cn
C. Farrar, Los Alamos National Laboratory, USA, farrar@lanl.gov
S. Galea, DSTO Australia, Australia, steve.galea@dsto.defence.gov.au
D. Le, US Army Research Laboratory, USA, dy.le@us.army.mil
I. Perez, Office of Naval Research, USA, perezl@onr.navy.mil
W. Prosser, NASA-Langley, USA, w.h.prosser@larc.nasa.gov
M. Ruzzene, NSF, USA, mruzzene@nsf.gov
L. Salvino, the Office of Naval Research Global, USA, liming.w.salvino.civ@mail.mil
P. Swindell, FAA, USA, paul.swindell@faa.gov