Index of /class/ee311/NOTES

[ICO]NameLast modifiedSizeDescription

[DIR]Parent Directory  -  
[   ]3DProc_IEEE.pdf02-Jun-2003 14:23 722K 
[   ]BORKAR.PDF24-May-2006 13:46 1.1M 
[   ]Contacts.pdf17-Apr-2003 17:24 683K 
[   ]Cu_Interconnect_Slides.pdf07-May-2005 16:16 3.6M 
[   ]Deposition_Planarization.pdf20-May-2004 14:16 1.5M 
[   ]ExamExample.pdf21-May-2001 10:40 305K 
[   ]ExamExampleMidterm.pdf03-May-1999 12:35 71K 
[   ]Future Devices.pdf26-May-2005 13:17 9.9M 
[   ]Future Devices 2.pdf01-Jun-2006 22:00 4.3M 
[   ]Future Devices 3.pdf05-Jun-2006 14:43 5.6M 
[   ]GateDielectric.pdf09-Apr-2004 23:15 2.6M 
[   ]GateOxNO_Kwong.pdf04-Apr-2003 14:52 721K 
[   ]GateOx_Gupta.pdf04-Apr-2003 15:03 115K 
[   ]GateOx_Momose.pdf04-Apr-2003 14:30 294K 
[   ]GateOx_Schuegraf.pdf04-Apr-2003 14:37 613K 
[   ]GateOx_Yang.pdf04-Apr-2003 14:37 235K 
[   ]Gate_Dielectric_Slides_Part1.pdf04-Apr-2005 18:18 2.4M 
[   ]Gate_Dielectric_Slides_Part2.pdf07-Apr-2005 15:53 4.4M 
[   ]Hutchby_ProcIEEE03.pdf29-May-2005 13:57 1.0M 
[   ]IBM_Silicides_Mann.pdf13-May-2003 17:38 2.0M 
[   ]Intel Strain Si EDL04.pdf29-May-2005 13:35 137K 
[   ]Intel Strained-Si-IEDM03.pdf29-May-2005 13:35 511K 
[   ]Intel_30nm.pdf03-Apr-2003 16:58 1.7M 
[   ]Interconnect Al Slides.pdf08-May-2006 14:28 2.7M 
[   ]Interconnect Cu Slides.pdf15-May-2006 11:00 2.6M 
[   ]Interconnect Lowk.pdf18-May-2006 17:58 2.6M 
[   ]Interconnect Scaling.pdf11-May-2006 18:01 1.9M 
[   ]InterconnectScalingSlides.pdf11-May-2006 17:59 4.5M 
[   ]InterconnectScalingThermal.pdf23-Apr-2004 07:25 231K 
[   ]InterconnectThermalModeling.pdf23-Apr-2004 07:25 120K 
[   ]Interconnect_Al.pdf27-Apr-2004 15:33 2.5M 
[   ]Interconnect_Cu.pdf15-May-2006 11:09 4.0M 
[   ]Interconnect_Future.pdf23-May-2006 14:02 9.2M 
[   ]Interconnect_Havemann.pdf13-May-2003 17:38 1.1M 
[   ]Isolation.pdf17-May-2004 12:06 2.0M 
[   ]Kapur1.pdf13-May-2003 17:40 383K 
[   ]Kapur2.pdf13-May-2003 17:40 313K 
[   ]King JAP2002.pdf28-Apr-2005 16:13 210K 
[   ]LokeCh1.pdf13-May-2003 17:41 2.5M 
[   ]LokeCh2.pdf13-May-2003 17:41 192K 
[   ]LokeCh3.pdf13-May-2003 17:41 58K 
[   ]Miller_ProcIEEE.pdf02-Jun-2003 14:18 336K 
[   ]Naeemi IEDM04.pdf23-May-2006 14:16 670K 
[   ]Nanoscale CMOS.pdf03-Apr-2003 17:04 1.5M 
[   ]NitOx_Kwong.pdf04-Apr-2003 14:51 257K 
[   ]Ohmic_Contacts.pdf13-Apr-2004 23:09 1.6M 
[   ]Ohmic_Contacts_Slides.pdf25-Apr-2005 22:45 1.8M 
[   ]PWong_BeyondMOS.pdf29-May-2003 22:59 2.1M 
[   ]Plummer.pdf03-Apr-2003 16:57 722K 
[   ]PowerModeling.pdf23-Apr-2004 07:25 59K 
[   ]Rim IEDM95.pdf29-May-2005 13:33 355K 
[   ]Rim IEEE TED2000.pdf29-May-2005 13:33 220K 
[   ]Robertson JAP04.pdf28-Apr-2005 16:13 2.0M 
[   ]SCOTT CROWDER.PDF24-May-2006 13:46 2.2M 
[   ]ShallowJunctions.pdf10-Apr-2006 16:39 1.2M 
[   ]Shallow Junctions Slides.pdf10-Apr-2006 16:46 4.9M 
[   ]Silicides & Metal gate Slides.pdf28-Apr-2005 15:56 3.6M 
[   ]Silicides.pdf28-Apr-2004 16:11 2.2M 
[   ]Strained Silicon Technology.pdf20-May-2005 10:44 2.1M 
[   ]TSUPREM4.pdf27-Apr-2004 11:05 72K 
[   ]TSUPREM4_Slides.pdf27-Apr-2004 11:05 143K 
[   ]Trends.pdf23-Mar-2004 14:52 1.7M 
[   ]TrendsSlides.pdf04-Apr-2006 22:29 6.2M 
[   ]Wilk_HighK.pdf12-Apr-2003 09:31 1.5M 
[   ]WooTED1-02.pdf14-Apr-2003 18:06 225K 
[   ]WooTED2-02.pdf14-Apr-2003 18:06 204K 
[   ]isolationSmeys.pdf21-Apr-2003 13:30 283K 
[   ]kapur IEDM04.pdf24-May-2006 13:48 1.7M